US 2025/0051599 A1Published application

Phenol compound, conductive paste composition, method for producing conductive paste composition, conductive wire, and method for producing conductive wire

AssigneeShin-Etsu Chemical Co., Ltd.

InventorsKoji HASEGAWA, Shiori Nonaka, Osamu Watanabe

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Abstract

A phenol compound represented by the following general formula (1A) makes it possible to provide a phenol compound as an additive for a conductive paste composition having a small decrease in electric conductivity in repetitive elongations and shrinkages and excellent printing processability, a conductive paste composition containing the additive, and a conductive wire made by using the conductive paste composition

Claims1

Dependent claims

A phenol compound selected from the group of any of the following formulae (2A), (8A), (9A), (13A), and (14A):

Dependencies are inferred from the claim text.

Facts

Application: 18/915,566Filed 15 Oct 2024
Priority: JP 2020-19374120 Nov 2020
Published: 13 Feb 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification41 codes

C09D 11/52
Inks: electrically conductive inks
C07C 39/15
Polycyclic with no unsaturation outside the aromatic rings: with all hydroxy groups on non-condensed rings , e.g. phenylphenol
C07C 39/16
With all hydroxy groups on non-condensed rings , e.g. phenylphenol: bis- alkanes; Tris-alkanes
C07C 39/19
Monocyclic with unsaturation outside the aromatic ring: containing carbon-to-carbon double bonds but no carbon-to-carbon triple bonds

Family

Application18/029,934Division · filed 3 Apr 2023
Application18/915,566Division
US 12,215,243 B2Related patent
US 12,590,219 B2Related patent
US 2023/0332008 A1Published application
US 2025/0051599 A1This patent

From the US filing history. Foreign family members aren’t listed.

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