Curable silicone composition having hot melt properties, cured product of same, and multilayer body comprising said composition

A curable silicone composition, comprising:

• (A) 100 parts by mass of an organopolysiloxane resin containing the following component (A1) and component (A2) in a mass ratio of 20:80 to 90:10, where the mass loss rate is 2.0 mass % or less after 1 hour exposure at 200° C.;
• (A1) an organopolysiloxane resin that is solid at 25° C., having a curing reactive functional group containing a carbon-carbon double bond in a molecule, containing 20 mol % or more of a siloxane unit as expressed by SiO4/2 of all siloxane units, and not independently having hot-melt properties;
• (A2) an organopolysiloxane resin that is solid at 25° C., not having a curing reactive functional group containing a carbon-carbon double bond in a molecule, containing 20 mol % or more of a siloxane unit as expressed by SiO4/2 of all siloxane units, and not independently having hot-melt properties;
• (B) 10 to 100 mass parts of a straight chain or branched organopolysiloxane that is liquid or has plasticity at 25° C., having at least two curing reactive functional groups having a carbon-carbon double bond in a molecule;
• (C) an organohydrogenpolysiloxane having at least two silicon-bonded hydrogen atoms in a molecule at an amount where the number of hydrogen atoms bonded to a silicon atom per one alkenyl group bonded to a silicon atom included in the entire composition is 0.5 to 20.0;
• (D) fine particles containing a hydrosilylation reaction catalyst, having a structure in which the hydrosilylation reaction catalyst is contained in a thermoplastic resin having a glass transition temperature (Tg) in a range of 110 to 200° C. where the amount of platinum metal in the fine particles is 0.1 to 2000 ppm by mass;
• and
• (E) fillers and pigments;
• wherein the amount of component (E) is in a range of 0.01 to 100 parts by mass relative to a total of 100 parts by mass of the components (A) to (D), and the overall composition has hot-melt properties.