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US 2025/0051569 A1Published application
Polyamide resin composition and molded article
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsTeruaki SAKUMA, Yasukazu SHIKANO, Takaaki MIYOSHI
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Abstract
A polyamide resin composition according to the present invention is characterized by comprising 100 parts by mass of a polyamide resin (A), 0.005-0.3 parts by mass of a copper compound (B), and 10-250 parts by mass of glass fibers (C), and is characterized in that the percentage content of boron elements in the glass fibers (C) is 1 mass % or less with respect to the total mass of the glass fibers (C).
Claims19
A polyamide resin composition comprising:
- 100 parts by mass of a polyamide resin (A);
- 0.005 parts by mass to 0.3 parts by mass of a copper compound (B);
- and
- 10 parts by mass to 250 parts by mass of glass fibers (C), wherein
- an amount of boron elements in the glass fibers (C) relative to a total mass of the glass fibers (C) is 1% by mass or less.
2 more elements
A polyamide resin composition comprising:
- 100 parts by mass of a polyamide resin (A);
- 0.005 parts by mass to 0.3 parts by mass of a copper compound (B);
- and
- 10 parts by mass to 60 parts by mass of glass fibers (C), wherein
- the polyamide resin composition has a tensile strength of 3.0 or more per part by mass of the glass fibers, the tensile strength being measured after heat aging by a method described below:
- (tensile strength after heat aging)
- a molded piece of a multi-purpose test piece (type A) produced using the polyamide resin composition by a method conforming to ISO 3167 is heat aged for 1,000 hours at 200° C. in a hot air circulating oven, and
- the test piece after heat aging is cooled at 23° C. for 24 hour or more, and then subjected to a tensile test at a tensile speed of 5 mm/min by a method conforming to ISO 527 to measure the tensile strength after heat aging (MPa).
5 more elements
Dependencies are inferred from the claim text.