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US 2025/0051532 A1Published application
Dielectric film-forming composition
AssigneeFujifilm Electronic Materials U.S.A., Inc.
InventorBinod B. De
Life of this patent
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Abstract
This disclosure relates to a dielectric film-forming composition that includes (a) at least one meth(acrylate)-containing polyphenylene ether resin and (b) at least one second resin selected from the group consisting of: i) at least one fully imidized polyimide polymer; ii) at least one polyamic acid ester; iii) at least one cyclized polydiene resin; and iv) a mixture of a cyclized polydiene resin and a cyanate ester compound.
Claims20
A dielectric film-forming composition, comprising:
- (a) at least one meth(acrylate)-containing polyphenylene ether resin, and
- (b) at least one second resin selected from the group consisting of:
- i) at least one fully imidized polyimide polymer;
- ii) at least one polyamic acid ester;
- iii) at least one cyclized polydiene resin;
- and
- iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound.
4 more elements
A photosensitive dielectric film forming composition, comprising:
- (a) at least one meth(acrylate)-containing polyphenylene ether resin, and
- (b) at least one second resin selected from the group consisting of:
- i) at least one fully imidized polyimide polymer;
- ii) at least one polyamic acid ester;
- iii) at least one cyclized polydiene resin;
- and
- iv) a mixture of at least one cyclized polydiene resin and at least one cyanate ester compound.
- (c) at least one cross-linker,
- (d) at least one catalyst, and
- (e) at least one solvent.
7 more elements
Dependencies are inferred from the claim text.