Resist composition and resist pattern formation method

A resist composition that generates an acid upon exposure and exhibits changed solubility in a developing solution under action of the acid, the resist composition comprising:

• a resin component (A1) that exhibits changed solubility in a developing solution under action of the acid;
• a photodecomposable base (D0);
• and
• a fluorine additive component (F),
• wherein the fluorine additive component (F) is a polymeric compound having a constitutional unit (f01) represented by General Formula (f01-1) and a constitutional unit (f02) represented by General Formula (f02-1),
• wherein R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Vf01 represents an alkylene group having 1 to 10 carbon atoms or a halogenated alkylene group having 1 to 5 carbon atoms, Yf01 represents —CO—O— or —O—CO—, Rf01 represents an organic group containing a fluorine atom, and nf01 represents an integer in a range of 0 to 5,
• wherein R represents a hydrogen atom, an alkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms, Vf02 represents a divalent hydrocarbon group which may have a substituent, nf02 represents an integer in a range of 0 to 2, Rf02 represents an acid dissociable group represented by General Formula (f02-r1-1), Rf021 and Rf022 each independently represent a hydrocarbon group which may have a substituent, Rf021 and Rf022 may be bonded to each other to form a ring structure, Yf02 represents a quaternary carbon atom, Rf023, Rf024, and Rf025 each independently represents a hydrocarbon group which may have a substituent, and * represents a bonding site for bonding to an oxygen atom to which Rf02 in General Formula (f02-1) is bonded.