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US 2025/0050463 A1Published application
Pad conditioner
AssigneeSAESOL Diamond Ind. Co., Ltd.
InventorSung Goo LEE
Life of this patent
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Abstract
A pad conditioner for dressing the surface of a CMP pad according to an embodiment of the present invention comprises: a substrate; and a plurality of protrusion members provided on the substrate. Each of the protrusion members may include: a cutting part that cuts the pad, a roughness control part that supports the cutting part and limits the indentation depth of the cutting part; and a body part that protrudes from the substrate and supports the roughness control part.
Claims7
A pad conditioner configured to dress a surface of a chemical mechanical polishing (CMP) pad, comprising:
- a substrate;
- and
- a plurality of protruding members provided on the substrate,
- wherein the protruding member includes a cutting part that cuts the pad, a roughness control part that supports the cutting part and restricts an indentation depth of the cutting part, and a body part that protrudes from the substrate to support the roughness control part.
1 more element
Dependencies are inferred from the claim text.