Laser scoring of polymeric substrates for use in packaging

Abstract

A method for laser scoring a polymeric substrate for packaging. The method includes providing a polymeric substrate and a laser apparatus. The laser apparatus includes a laser arranged and disposed to provide laser energy to a surface of the polymeric substrate. The laser apparatus is configured with a control sequence having a power setting and a frequency setting to deliver the laser energy. The laser energy is directed from the laser apparatus according to the control sequence at a power corresponding to the power setting and a frequency corresponding to the frequency setting to the polymeric substrate to form a score channel into the surface. The laser energy ablates the polymeric substrate to form the score channel. A laser scoring system and an easy-open package utilizing score channels formed by laser ablation are also disclosed.

Dependencies are inferred from the claim text.