Silver powder, mixed silver powder, and conductive paste, and method for manufacturing silver powder and mixed silver powder
AssigneeDowa Electronics Materials Co., Ltd.
InventorMasanori FUJII
Life of this patent
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Abstract
Obtained are a silver powder and a mixed powder that can achieve low-resistance electrode wiring when printing wires, and a conductive paste using these powders. The silver powder includes, as 20% or more and less than 95% of all particles, silver particles whose main region of the silver particle upper surface is the (111) plane or a plane close to the (111) plane. The KAM value of the silver particles is 0.4 or more and 1.0 or less.
Claims13
A silver powder comprising, as 20% or more and less than 95% of all particles, silver particles whose main region of a silver particle upper surface is a (111) plane or a plane close to the (111) plane, wherein a KAM value of the silver particles is 0.4 or more and 1.0 or less.
A method for manufacturing silver powder, the method comprising applying strain to a highly crystalline silver powder that includes, as 30% or more of all particles, silver particles whose main region of a silver particle upper surface is a (111) plane or a plane close to the (111) plane, a KAM value of the silver particles being less than 0.4, wherein the strain is applied by applying mechanical energy until the KAM value of the silver particles becomes 0.4 or more and 1.0 or less.
A mixed silver powder comprising at least silver particles whose main region of a silver particle upper surface is a (111) plane or a plane close to the (111) plane, wherein a KAM value of the silver particles is 0.4 or more and 1.0 or less.
Dependencies are inferred from the claim text.