Method of cleaning a bottom plate

A method of cleaning a bottom plate, wherein steps of the method comprising:

• (a) welding a soldering lug:
• welding at least one soldering lug onto an adjacent bottom plate;
• (b) covering with a liquid material:
• filling the liquid material between the adjacent bottom plate and the at least one soldering lug to cover a substance to be cleaned on the adjacent bottom plate;
• (c) placing in a chamber:
• placing the adjacent bottom plate containing the liquid material in the chamber;
• (d) controlling a chamber temperature:
• controlling the chamber to at least one predetermined temperature, the predetermined temperature being coordinated with viscosity of the liquid material, between 25 and 200° C.;
• and
• (e) oscillating differential pressure variation cleaning:
• generating oscillating high-pressure pressure increasing and reducing and oscillating low-pressure vacuum pumping for a gas in the chamber using a pressure increasing and reducing device and a vacuum generator, so that gas molecules in the chamber generate a differential pressure variation airflow, which is differential pressure variation of oscillating gas molecules between oscillating high pressure and oscillating low pressure, and oscillating differential pressure variation in pressure ranging from a maximum of 50 atmospheric pressure to a minimum of 10−5 atmospheric pressure, causing variation of the liquid material by oscillating differential pressure variation of the gas molecules using high pressure of the pressure increasing and reducing device and low pressure of the vacuum generator, rubbing and scrubbing the liquid material in contact with the substance to be cleaned by differential pressure variation, and taking the substance to be cleaned attached to the adjacent bottom plate away from the adjacent bottom plate and the liquid material.

A method of cleaning a bottom plate, wherein steps of the method comprising:

• (a) welding a soldering lug:
• welding at least one soldering lug onto an adjacent bottom plate;
• (b) covering with a liquid material:
• filling the liquid material between the adjacent bottom plate and the at least one soldering lug to cover a substance to be cleaned on the adjacent bottom plate;
• (c) placing in a chamber:
• placing the adjacent bottom plate containing the liquid material in the chamber;
• (d) controlling a chamber temperature:
• controlling the chamber to at least one predetermined temperature, the predetermined temperature being coordinated with viscosity of the liquid material, between 25 and 200° C.;
• and
• (e) oscillating differential pressure variation cleaning:
• generating oscillating pressure increasing and reducing for a gas in the chamber using a pressure increasing and reducing device, so that gas molecules in the chamber generate a differential pressure variation airflow, which is differential pressure variation from high pressure to 1 atmospheric pressure, and oscillating differential pressure variation in pressure ranging from a maximum of 50 atmospheric pressure to a minimum of 1 atmospheric pressure, causing variation of the liquid material by oscillating differential pressure variation of a high-pressure gas using the pressure increasing and reducing device, rubbing and scrubbing the liquid material in contact with the substance to be cleaned by fluctuation, and taking the substance to be cleaned attached to the adjacent bottom plate away from the adjacent bottom plate and the liquid material.

A method of cleaning a bottom plate, wherein steps of the method comprising:

• (a) welding a soldering lug:
• welding at least one soldering lug onto an adjacent bottom plate;
• (b) covering with a liquid material:
• filling the liquid material between the adjacent bottom plate and the at least one soldering lug to cover a substance to be cleaned on the adjacent bottom plate;
• (c) placing in a chamber:
• placing the adjacent bottom plate containing the liquid material in the chamber;
• (d) controlling a chamber temperature:
• controlling the chamber to at least one predetermined temperature, the predetermined temperature being coordinated with viscosity of the liquid material, between 25 and 200° C.;
• and
• (e) physical dissolution cleaning:
• generating at least a predetermined pressure ranging from a maximum of 50 atmospheric pressure to a minimum of 1 atmospheric pressure in the chamber using a pressure increasing device, dissolving the substance to be cleaned attached to the adjacent bottom plate in the liquid material using physical dissolution generated by contacting the filled liquid material with the substance to be cleaned, and taking the substance to be cleaned attached to the adjacent bottom plate away from the adjacent bottom plate and the liquid material using diffusion force generated by the predetermined temperature and a concentration gradient after dissolution.