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US 2025/0043050 A1Published application
Curable polymer, curable composition, prepreg, multilayer body, metal clad laminate and wiring board
AssigneeAGC Inc.
InventorsKazumi HASHIMOTO, Tsukasa USUDA, Yusuke YASU, Takafumi IGARASHI
Life of this patent
Estimating the term…
Abstract
A curable polymer containing one or more type(s) of structural units (UX) represented by the following formula and which is for production of a prepreg, a metal clad laminate or a wiring board: in which X is a single bond or an oxygen atom; the benzene ring optionally has a substituent other than the substituent in the above formula; and n is an integer of 0 or more.
Claims12
A curable polymer comprising one or more type(s) of structural units (UX) represented by the following formula and which is for production of a prepreg, a metal clad laminate or a wiring board:
- wherein X is a single bond or an oxygen atom;
- the benzene ring optionally has a substituent other than the substituent in the above formula;
- and n is an integer of 0 or more.
Dependencies are inferred from the claim text.