Low resistance switches

A die, comprising:

• first fins extending in a first direction;
• second fins extending in the first direction;
• gates formed over the first fins and the second fins, wherein the gates extend in a second direction that is perpendicular to the first direction, and each of the gates extends contiguously over the first fins and the second fins;
• first source/drain contact layers formed over the first fins, wherein the first source/drain contact layers extend in the second direction, and the gates and the first source/drain contact layers are interleaved;
• second source/drain contact layers formed over the second fins, wherein the second source/drain contact layers extend in the second direction, and the gates and the second source/drain contact layers are interleaved;
• a first gate metal layer;
• a second gate metal layer, wherein the first source/drain contact layers are between the first gate metal layer and the second gate metal layer in the second direction;
• a third gate metal layer, wherein the second source/drain contact layers are between the second gate metal layer and the third gate metal layer in the second direction;
• first gate vias electrically coupling the first gate metal layer to the gates;
• second gate vias electrically coupling the second gate metal layer to the gates;
• and
• third gate vias electrically coupling the third gate metal layer to the gates.

A system, comprising:

• a switch comprising:
• fins extending in a first direction;
• gates formed over the fins, wherein the gates extend in a second direction that is perpendicular to the first direction;
• source/drain contact layers formed over the fins, wherein the source/drain contact layers extend in the second direction, and the gates and the source/drain contact layers are interleaved;
• source/drain metal layers, wherein each of the source/drain metal layers extends over at least a portion of a respective one of the source/drain contact layers;
• source/drain vias electrically coupling the source/drain contact layers to the source/drain metal layers;
• a first gate metal layer;
• a second gate metal layer, wherein the source/drain contact layers are between the first gate metal layer and the second gate metal layer in the second direction;
• first gate vias electrically coupling the first gate metal layer to the gates;
• and
• second gate vias electrically coupling the second gate metal layer to the gates;
• a power switch controller coupled to the first gate metal layer and the second gate metal layer;
• a power distribution network coupled to a first subset of the source/drain metal layers;
• and
• a circuit coupled to a second subset of the source/drain metal layers.