Piezoelectric vibration device

Abstract

A piezoelectric vibration device that can suppress deflection of a sealing member during molding using resin is provided. In a piezoelectric vibration device 1 including an oscillator 2 configured such that at least a vibrating portion 5 is sealed with a first sealing member 7 and a second sealing member 8 that are sealing members, an integrated circuit element 10 that is at least an electronic component element, a substrate 11 including a mounting surface 11a on which the oscillator 2 and the integrated circuit element 10 are mounted, and a molding portion 12 in which at least the oscillator 2 is covered with resin, the oscillator 2 includes a protecting member 9 that partially or entirely covers at least one of the first sealing member 7 and the second sealing member 8.

Dependencies are inferred from the claim text.