Display device and manufacturing method thereof

A display device comprising:

• a sub-pixel disposed on a substrate and including a light emitting element, the light emitting element including a pixel electrode, a light emitting layer disposed on the pixel electrode, a control layer disposed on the light emitting layer, and a common electrode disposed on the control layer;
• a connection pattern disposed between the substrate and the light emitting element and electrically connected to the light emitting element;
• a data line electrically connected to the sub-pixel and receiving a data signal;
• a dummy wire disposed to be spaced apart from the data line;
• and
• a dummy pattern integrally formed with the dummy wire and disposed to be spaced apart from the connection pattern,
• wherein the dummy pattern includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive sequentially disposed on the substrate;
• and
• wherein the second conductive layer is in direct contact with the fourth conductive layer.

A manufacturing method of a display device, comprising:

• forming a connection pattern and a dummy pattern disposed to be spaced apart from each other on a substrate;
• forming a via layer disposed on the substrate and including a contact portion exposing the connection pattern and a via hole exposing the dummy pattern;
• forming a pixel electrode disposed on the via layer and electrically connected to the connection pattern through the contact portion;
• forming a light emitting layer disposed on the pixel electrode;
• forming a control layer disposed on the light emitting layer;
• and
• forming a common electrode disposed on the control layer,
• wherein the dummy pattern includes a first conductive layer, a second conductive layer, a third conductive layer, a fourth conductive layer, and a fifth conductive layer sequentially disposed on the substrate;
• wherein the first conductive layer, the third conductive layer, and the fifth conductive layer include titanium, and the second conductive layer and the fourth conductive layer include aluminum;
• and
• wherein a side surface of the second conductive layer is recessed from a side surface of the third conductive layer, and a side surface of the fourth conductive layer is recessed from a side surface of the fifth conductive layer.