Electronic device and manufacturing method thereof

A manufacturing method of an electronic device, comprising the steps of:

• providing a substrate;
• disposing a plurality of electronic components on the substrate so that there is a first pitch between two adjacent electronic components in a first direction;
• and
• applying a protective glue to the electronic components and the substrate, so that the protective glue forms at least one groove, wherein the at least one groove is disposed between the two adjacent electronic components,
• wherein a distance between an edge of one of the two adjacent electronic components and the at least one groove satisfies an equation:
• 0.3
• mm
• ≤
• D
• ⁢
• 1
• <
• (
• P
• /
• 2
• )
• ,
• where D1 is the distance between the edge of the one of the two adjacent electronic components and the at least one groove, and P is the first pitch.