Light emitting device and light emitting module including the same

A light emitting device comprising:

• a light emitting structure including a first light emitting structure and a second light emitting structure, each of the first light emitting structure and the second light emitting structure comprising a first conductivity type semiconductor layer, a second conductivity type semiconductor layer, and an active layer formed between the first conductivity type semiconductor layer and the second conductivity type semiconductor layer;
• a first conductive bonding member disposed on the first light emitting structure and electrically connected to the first conductivity type semiconductor layer;
• a second conductive bonding member disposed on the first light emitting structure and spaced apart from the first conductive bonding member and electrically connected to the second conductivity type semiconductor layer;
• a third conductive bonding member disposed on the second light emitting structure and electrically connected to the first conductivity type semiconductor layer;
• a fourth conductive bonding member disposed on the second light emitting structure to be spaced apart from the third conductive bonding member and electrically connected to the second conductivity type semiconductor layer;
• a light transmitting member disposed to cover the light emitting structure and having a first side surface and a second side surface having a length greater than that of the first side surface;
• and
• a white barrier member covering the first side surface and the second side surface of the light transmitting member,
• wherein the first conductive bonding member in the first light emitting structure face the third conductive bonding member in the second light emitting structure along the second side and the second conductive bonding member in the first light emitting structure face the fourth conductive bonding member in the second light emitting structure along the second side;
• and
• wherein the first conductive bonding member and the second conductive bonding member are arranged along the first side and in parallel to the white barrier member.