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US 2025/0040305 A1Published application
Method for manufacturing separable semiconductor substrate, and semiconductor substrate, thin film device and composite device manufactured by the same
AssigneeLumigntech Co., Ltd.
InventorsHae Yong LEE, Young Jun CHOI, Hae Gon OH
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Abstract
The present invention relates to a method of manufacturing a separable semiconductor substrate, and a thin film device and composite device manufactured by the same, and the method of manufacturing a separable semiconductor substrate according to an embodiment of the present invention includes providing a substrate and forming a buffer layer including carbon and aluminum nitride.
Claims17
A method of manufacturing a separable semiconductor substrate, comprising:
- providing a substrate;
- and
- forming a buffer layer including carbon and aluminum nitride.
A separable semiconductor substrate comprising:
- a mother substrate;
- and
- a buffer layer disposed on the mother substrate and including carbon and aluminum nitride.
Dependencies are inferred from the claim text.