Cylinder head, transfer and bonding system including the same, and method for driving the same

A transfer and bonding system, comprising:

• a cylinder head;
• an imaging device configured to obtain an image in a direction;
• and
• a heat source configured to apply heat to the cylinder head, wherein
• the cylinder head includes:
• a first transmissive portion including a first air path extending to an air layer;
• a first bracket accommodating the first transmissive portion;
• a second transmissive portion spaced apart from the first transmissive portion in the direction by the air layer;
• a second bracket accommodating the second transmissive portion;
• and
• an elastic member surrounding side surfaces of the first bracket and the second bracket, and
• one of the first bracket and the second bracket includes a second air path extending to the air layer.

A driving method, comprising:

• providing a cylinder head comprising:
• a first transmissive portion including a first air path extending to an air layer;
• a first bracket accommodating the first transmissive portion;
• a second transmissive portion spaced apart from the first transmissive portion in a direction by the air layer;
• a second bracket accommodating the second transmissive portion;
• and
• an elastic member surrounding side surfaces of the first bracket and the second bracket, and
• one of the first bracket and the second bracket includes a second air path extending to the air layer;
• providing a transfer substrate that includes a carrier substrate coupled to a plurality of light emitting elements;
• providing a thin film transistor substrate that includes a thin film transistor layer;
• moving the cylinder head towards the transfer substrate;
• discharging air from the cylinder head through the second air path to couple the transfer substrate to the first transmissive portion of the cylinder head;
• moving the cylinder head that is coupled to the transfer substrate towards a thin film transistor substrate;
• injecting air into the cylinder head through the second air path to press the first transmissive portion of the cylinder head against the transfer substrate;
• discharging the air from the cylinder head through the second air path to couple the carrier substrate to the first transmissive portion of the cylinder head;
• and
• injecting the air into the cylinder head via the second air path to separate the carrier substrate from the first transmissive portion of the cylinder head.