Solid-state imaging device
AssigneeSony Semiconductor Solutions Corporation
InventorSHINYA ITOH
Life of this patent
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Abstract
A solid-state imaging device includes: a substrate including a first surface and a second surface that is opposed to the first surface; a first through-wiring that penetrates from the first surface of the substrate to the second surface of the substrate and through which electric charge is to be transferred; an electroconductive body formed in the substrate and along a periphery of a side surface of the first through-wiring with a dielectric body being interposed between the electroconductive body and the side surface; and a voltage supply circuit that supplies the electroconductive body with a voltage that causes a voltage difference between the first through-wiring and the electroconductive body to be small, when the electric charge is to be transferred to the first through-wiring.
Claims13
A solid-state imaging device comprising:
- a substrate including a first surface and a second surface that is opposed to the first surface;
- a first through-wiring that penetrates from the first surface of the substrate to the second surface of the substrate and through which electric charge is to be transferred;
- an electroconductive body formed in the substrate and along a periphery of a side surface of the first through-wiring with a dielectric body being interposed between the electroconductive body and the side surface;
- and
- a voltage supply circuit that supplies the electroconductive body with a voltage that causes a voltage difference between the first through-wiring and the electroconductive body to be small, when the electric charge is to be transferred to the first through-wiring.
A solid-state imaging device comprising:
- a substrate including a first surface and a second surface that is opposed to the first surface;
- a first photoelectric converter disposed on the first surface and converting light into electric charge;
- a first through-wiring that penetrates from the first surface of the substrate to the second surface of the substrate and through which the electric charge is to be transferred from the first photoelectric converter;
- an electroconductive body formed in the substrate and along a periphery of a side surface of the first through-wiring with a dielectric body being interposed between the electroconductive body and the side surface;
- a voltage supply circuit that supplies a predetermined voltage to the electroconductive body;
- a second photoelectric converter disposed in the substrate and at a position adjacent to the first through-wiring, the second photoelectric converter converting light into the electric charge;
- and
- a light shielding wall extending from the electroconductive body, the light shielding wall surrounding at least a portion of a periphery of a side surface of the second photoelectric converter, the light shielding wall having a higher light shielding property than the substrate.
Dependencies are inferred from the claim text.