Image sensor package

An image sensor package comprising:

• an image sensor chip having a chip body comprising an active surface, a rear surface opposite to the active surface, and a photosensitive layer formed on the active surface, wherein the active surface comprises:
• a photosensitive area, wherein the photosensitive layer is located in the photosensitive area;
• and
• a non-sensitive area surrounding the photosensitive area;
• a metal dam formed on the active surface of the chip body, located on the non-sensitive area of the active surface, surrounding the photosensitive area, electrically insulated from the chip body, and has a first thickness, wherein a gap is defined between an inside surface of the metal dam and an outside surface of the photosensitive area;
• and
• a transparent substrate having:
• a surface facing toward the active surface of the chip body;
• and
• a glue dam formed on the surface and having a second thickness, wherein the glue dam is aligned with the metal dam, and the transparent substrate is bonded to the image sensor chip through the glue dam and the metal dam, wherein the second thickness is less than the first thickness.