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US 2025/0040261 A1Published application
Wire bond and circuit board interconnects for solar cell modules
AssigneeMaxeon Solar Pte. Ltd.
InventorsChin Yeung WONG, Hui Khim CHO, Jeevan SIVARAMAN, Renante REFAMONTE
Life of this patent
Estimating the term…
Abstract
A solar cell module with interconnect wires wire-bonded to back-contact solar cells. A solar cell module using an interconnect board to electrical interconnect back-contact solar cells. The interconnect board may also contain a bypass diode and circuitry to connect the bypass diode to solar cells of the module.
Claims20
A string of solar cells comprising:
- a first and second crystalline silicon solar cell, each crystalline silicon solar cell having a plurality of bond pads;
- and
- a plurality of conductive interconnect wires, each interconnect wire electrically connecting the first solar cell to the second solar cell in series, each interconnect wire comprising a first wedge bond bonding the interconnect wire to a bond pad on the first solar cell and a second wedge bond bonding the interconnect wire to a bond pad on the second solar cell.
A method comprising:
- placing a first and second crystalline silicon solar cells on a fixture;
- each solar cell having a plurality of bond pads;
- placing a plurality of conductive interconnect wires on the first and second solar cells;
- and
- ultrasonic wire bonding each interconnect wire to a bond pad on the first solar cell and a bond pad on the second solar cell, the ultrasonic wire bonding forming a wedge bond.
2 more elements
A solar module comprising:
- an interconnect board comprising:
- a conductive layer comprising a conductive trace and bond pads, the conductive layer sandwiched between two insulating layers,
- a plurality of openings in one of the two insulating layers, each opening aligned with one of the bond pads of the conductive layer, and
- a plurality of solder joints filling the plurality of openings, each solder joint in contact with one of the bond pads of the conductive layer;
- and
- a first and second back-contact solar cells attached to the interconnect board, each solar cell comprising a bond pad disposed on a back surface of the solar cell, the bond pad of each of the solar cell in contact with one of the solder joints of the interconnect board,
- the conductive trace of the interconnect board electrically connecting the first solar cell to the second solar cell.
4 more elements
A method of manufacturing a solar module, comprising:
- providing an interconnect board comprising:
- a conductive layer comprising a conductive trace and bond pads, the conductive layer sandwiched between two insulating layers,
- a plurality of openings in one of the two insulating layers, each opening aligned with one of the bond pads of the conductive layer, and
- a plurality of solder slugs, each solder slug in contact with one of the bond pads of the conductive layer, each solder slug located within one of the openings;
- placing a first and second back-contact solar cells unto to the interconnect board so that bond pads of the first and second solar cells are in contact with the solder slugs;
- and
- laminating the interconnect board and the first and second solar cells in an encapsulant at a temperature sufficient to reflow solder the bond pads of the first and second solar cells to the bond pads of the interconnect board.
4 more elements
Dependencies are inferred from the claim text.