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US 2025/0040254 A1Published application
Package structures
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsMing-Fa Chen, Sung-Feng Yeh, Tzuan-Horng Liu, Chao-Wen Shih
Life of this patent
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Abstract
A package structure including a bottom die, a first die, a second die, an encapsulant and a first dummy structure is provided. The first die and a second die are bonded to a first side of the bottom die. The encapsulant laterally encapsulates the first die and the second die. The first dummy structure is bonded to the first side of the bottom die, wherein a sidewall of the first dummy structure is coplanar with a first sidewall of the bottom die.
Claims20
A package structure, comprising:
- a bottom die;
- an encapsulant disposed on the bottom die;
- and
- a first dummy structure bonded to the first side of the bottom die, wherein a first sidewall of the first dummy structure is coplanar with a first sidewall of the bottom die, and a second sidewall of the first dummy structure is in contact with a sidewall of the encapsulant,
- wherein the first dummy structure comprises a silicon substrate and a first insulating layer on the silicon substrate.
2 more elements
A package structure, comprising:
- a bottom component;
- a first component bonded to the bottom component;
- a first dummy structure bonded to the bottom component;
- and
- a second dummy structure bonded to the bottom component and surrounding the first component and the first dummy structure.
2 more elements
A package structure, comprising:
- a bottom die;
- a first component and a second component having different sizes and bonded to the bottom die;
- and
- a first dummy die bonded to the bottom die, wherein the first dummy die comprises a first portion and a second portion connected each other and extended along different directions.
1 more element
Dependencies are inferred from the claim text.