Method of manufacturing an electronic device
AssigneeInnolux Corporation
InventorsMing-Jou Tai, Chia-Hao Tsai
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Abstract
The present disclosure provides an electronic device comprising a substrate, and an electrode. The substrate comprises a base, a first metal layer disposed on the base, a second metal layer disposed on the first metal layer and electrically connected to the first metal layer, and an insulating layer disposed on second metal layer. The electrode is disposed on the insulating layer. The substrate comprises a high-level region and a low-level region. The insulating layer comprises an opening in the low-level region to expose a part of the second metal layer. A part of the electrode is disposed in the high-level region and another part of the electrode is disposed in the low-level region.
Claims7
An electronic device, comprising:
- a substrate, comprising:
- a base;
- a first metal layer, disposed on the base;
- a second metal layer, disposed on the first metal layer and electrically connected to the first metal layer;
- and
- an insulating layer, disposed on the second metal layer, wherein the substrate comprises a first region and a second region, the insulating layer comprises a top surface in the first region and an opening in the second region, and a part of the second metal layer is exposed by the opening;
- and
- an electrode, disposed on the insulating layer,
- wherein a part of the electrode is disposed in the first region, and another part of the electrode is disposed in the second region.
Dependencies are inferred from the claim text.