Black wheels for transporting ultra-thin silicon wafer
AssigneeTcl Zhonghuan Renewable Energy Technology Co., Ltd.
InventorsMuren BAO, Feiyang LI
Life of this patent
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Abstract
A black wheel for transporting an ultra-thin silicon wafer may include grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel. Compressed air lines are respectively accommodated within the grooves, and an air outlet of each of the compressed air lines is provided to align with a side of the ultra-thin silicon wafer close to a next process device.
Claims16
A black wheel for transporting an ultra-thin silicon wafer, comprising grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel,
- wherein compressed air lines are respectively accommodated within the grooves, and an air outlet of each of the compressed air lines is provided to align with a side of the ultra-thin silicon wafer close to a next process device.
A black wheel for transporting an ultra-thin silicon wafer, wherein the black wheel is configured to convert the ultra-thin silicon wafer from a vertical state to a horizontal state and transport the ultra-thin silicon wafer onto a horizontal conveyor belt at a next process, and
- wherein the black wheel comprises grooves provided on a side surface of the black wheel along a circumferential direction of the black wheel, and compressed air lines are respectively accommodated within the grooves and are configured to blow up a side of the ultra-thin silicon wafer close to the horizontal conveyor belt when the silicon wafer approaches the horizontal conveyor belt, to enable the ultra-thin silicon wafer to be transported onto the horizontal conveyor belt.
Dependencies are inferred from the claim text.