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US 2025/0038010 A1Published application
Vias including an electroplated layer and methods for fabricating the vias
AssigneeCorning Incorporated
InventorsBomi Kim, Joo Sok Kim, Hyung Soo Moon, Seong-ho Seok
Life of this patent
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Abstract
A via includes a substrate, a seed layer, and an electroplated layer. The substrate includes a first surface and a second surface opposite to the first surface. The substrate includes a tapered through-hole extending from the first surface to the second surface. The seed layer includes copper contacting the substrate on sidewalls of the tapered through-hole. The electroplated layer includes copper contacting the seed layer.
Claims20
A via comprising:
- a substrate comprising a first surface and a second surface opposite to the first surface, the substrate comprising a tapered through-hole extending from the first surface to the second surface;
- a seed layer comprising copper contacting the substrate on sidewalls of the tapered through-hole;
- and
- an electroplated layer comprising copper contacting the seed layer.
1 more element
A via comprising:
- a substrate comprising a first surface and a second surface opposite to the first surface, the substrate comprising a tapered through-hole extending from the first surface to the second surface;
- a seed layer comprising copper contacting the substrate on sidewalls of the tapered through-hole;
- an electroplated layer comprising copper contacting the seed layer;
- and
- a polymer contacting the electroplated layer and filling the through-hole.
2 more elements
A method for fabricating a via, the method comprising:
- forming a tapered through-hole through a substrate from a first surface of the substrate to a second surface of the substrate opposite to the first surface;
- applying a seed layer comprising copper on sidewalls of the tapered through-hole;
- and
- applying a copper layer on the seed layer via electroplating.
1 more element
Dependencies are inferred from the claim text.