Chamber for substrate backside and bevel deposition

A processing system comprising:

• a chamber body comprising:
• an upper chamber body having a lid;
• and
• a lower chamber body having a bottom, wherein the upper chamber body and lower chamber body enclose an area defining a processing environment;
• an upper heater moveably disposed in the upper chamber body, the upper heater comprising:
• a heater body have two or more heaters disposed in concentric zones;
• a moveable support attached to the heater body;
• and
• an upper step formed in the heater body along an outer perimeter and exposed to the processing environment;
• and
• a lower showerhead fixedly disposed in the lower chamber body, the lower showerhead comprising:
• a showerhead body having a top surface configured to support a substrate, the showerhead body having a lower step disposed along an outer perimeter, wherein the substrate is configured to extend from the top surface partially over the lower step;
• lift pins disposed in the showerhead body configured to extend through the top surface and support the substrate thereon;
• and
• gas holes disposed through the showerhead body in a first zone along the top surface and a second zone on the lower step, the gas holes configured to independently flow both a process and non-process gas in the first zone and the second zone, wherein the processing system is configured to perform deposition on a backside and bevel edge of the substrate.