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US 2025/0034712 A1Published application
Methods and apparatus in-situ measurements
AssigneeASM IP Holding B.V.
InventorsAnirudhan Chandrasekaran, Jereld Lee Winkler, Shubham Garg, Ryan Paull
Life of this patent
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Abstract
Various embodiments of the present technology may provide in-situ metrology. A system may include a first sensor embedded within a susceptor and flush with a top surface of the susceptor. The system may also include lift pin pads having a second sensor arranged to contact a lift pin. The system may also include a third sensor arranged outside of a reaction chamber and adjacent to a view port. The system may also include a processor to receive output signals from one or more of the sensors and use the output signals to determine a film thickness on a wafer.
Claims22
An apparatus, comprising:
- a susceptor configured to support a substrate, and comprising a first surface and a second, opposing surface, and a plurality of first through-holes extending from the first surface to the second surface and a plurality of second through-holes extending from the first surface to the second surface;
- a set of first pins, each first pin arranged within a through-hole from the plurality of first through-holes, wherein each first pin is configured to have multiple positions;
- and
- a set of second pins, each second pin comprising:
- a first end adjacent to the first surface of the susceptor and a second end, opposite the first end, wherein:
- each second pin is arranged within a through-hole from the plurality of second through-holes;
- and
- each second pin has a single, fixed position;
- and
- a sensor disposed at and electrically connected to the first end.
7 more elements
An apparatus, comprising:
- a susceptor comprising
- a first surface and an opposing, second surface;
- a plurality of through-holes extending from the first surface to the second surface;
- a plurality of lift pins, each lift pin disposed within a respective through-hole from the plurality of through-holes;
- and
- a plurality of sensors embedded within the susceptor, and each sensor comprising a sensing surface disposed flush with the first surface, wherein the sensor is configured to generate an output signal corresponding to a change in frequency of the sensing surface.
3 more elements
A system, comprising:
- a reaction chamber;
- a susceptor disposed within the reaction chamber and comprising a first surface and an opposing, second surface;
- a plurality of sensors embedded within the susceptor, and each sensor comprising a sensing surface disposed flush with the first surface, wherein the sensor is configured to generate an output signal corresponding to a change in frequency of the sensing surface;
- and
- a processor electrically connected to each sensor and configured to receive each output signal and determine a thickness map based on a combination of the output signals and a location of each sensor relative to the other sensors.
2 more elements
A system, comprising:
- a susceptor disposed within an interior space of a reaction chamber, wherein the susceptor comprises a plurality of through-holes;
- a plurality of pins disposed within a respective through-hole from the plurality of through-holes;
- a plurality of pin pads disposed below the susceptor, wherein each pin pad is aligned with one pin from the plurality of pins;
- a sensor disposed on a top surface of the pin pad, wherein the sensor generates a signal corresponding to mass;
- and
- a processor coupled to the sensor and configured to receive the signal, determine a change in mass based on the signal, and determine a film thickness based on the determined change in mass.
3 more elements
A system, comprising:
- a reaction chamber comprising a sidewall and a bottom surface that is perpendicular to the sidewall, wherein the sidewall and bottom surface define an interior space of the reaction chamber;
- a susceptor disposed within the interior space;
- a view port disposed within the sidewall;
- an emissometer disposed on an exterior of the reactor and adjacent to the view port, wherein the first emissometer generates an output signal;
- and
- a processor connected to the emissometer and configured to receive the output signal and detect a change in value of the output signal.
3 more elements
Dependencies are inferred from the claim text.