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US 2025/0034319 A1Published application
Epoxy resin composition, cured product, encapsulant and adhesive
AssigneeAsahi Kasei Kabushiki Kaisha
InventorsRyosuke OKAMOTO, Naoya KAMIMURA, Kenzo ONIZUKA
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Abstract
Provided is an epoxy resin composition containing (A) epoxy resin, and (B) a heteroatom-containing curing agent, wherein molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.
Claims12
An epoxy resin composition comprising
- (A) epoxy resin, and
- (B) a heteroatom-containing curing agent, wherein
- molecular weight α of the heteroatom-containing curing agent (B) is 200≤α≤1200, and
- ratio α/β of the molecular weight α to number β of heteroatoms in a structure of the heteroatom-containing curing agent (B) is 30≤α/β≤95.
1 more element
Dependencies are inferred from the claim text.