Method for bonding polyimide film, bonding device, and bonded structure having polyimide film bonding part

Abstract

A polyimide film bonding method according to an embodiment may include: bonding two polyimide films to each other by bringing a hot plate into contact with a portion where the two polyimide films are superposed. A heating temperature by the contact with the hot plate is 450° C. or higher. A contact time between the polyimide films and the hot plate is 12 seconds or less. A polyimide film bonding method according to another embodiment may include: bonding two polyimide films to each other by irradiating, with a laser beam, a portion where the two polyimide films are superposed. A top surface of the superposed polyimide films is irradiated with the laser beam while a bottom surface of the superposed polyimide films is kept tightly attached to a heat insulator.

Dependencies are inferred from the claim text.