Thermal dissipation in stacked memory devices and associated systems and methods

A system-in-package (SiP) device, comprising:

• an interposer substrate;
• a processing unit carried by the interposer substrate;
• and
• a high-bandwidth memory (HBM) device carried by the interposer substrate, wherein the HBM device is coupled to the processing unit by an interposer bus, and wherein the HBM device comprises:
• an interface die carried by the interposer substrate;
• a plurality of memory dies carried by the interface die;
• a plurality of first through substrate vias (TSVs) communicably coupling each of the plurality of memory dies and the interface die;
• and
• a cooling network configured to transport heat away from the interface die, wherein the cooling network comprises:
• a conductive layer thermally coupled to and carried by an upper surface of the interface die;
• and
• a plurality of second TSVs thermally coupled to the conductive layer and extending from the conductive layer to an elevation at or above a top surface of an uppermost memory die.

A stacked semiconductor device, comprising:

• an interface die having an active signal routing region and an active circuit region;
• a plurality of memory dies carried by an upper surface of the interface die, wherein each of the plurality of memory dies is communicably coupled to the interface die by a plurality of signal through substrate vias (TSVs) extending from a first metallization layer in the active signal routing region of the interface die to a second metallization layer in an uppermost memory die;
• a cooling layer carried by the upper surface of the interface die over at least a portion of the active circuit region;
• and
• a plurality of cooling TSVs each having a proximal region thermally coupled to the cooling layer at a contact point and a distal region at an elevation parallel to or above a top surface of the uppermost memory die, wherein:
• the cooling layer is configured to communicate heat in a lateral direction towards the contact points, and
• the plurality of cooling TSVs are configured to communicate heat in an upward direction away from the cooling layer.