Plated via-in-via vertical connection

A method of manufacturing a via-in-via vertical interconnect in a printed circuit board (PCB), comprising:

• drilling a first hole through the PCB and through an internal conductive layer of the PCB;
• drilling a second hole into a top side of the PCB around the first hole, wherein a diameter of the second hole is greater than a diameter of the first hole and a bottom of the second hole is above the internal conductive layer;
• plating the first hole and the second hole with a conductive material to form an outer layer;
• drilling a third hole through the PCB along the second hole, wherein a diameter of the third hole is less than the diameter of the second hole and is greater than the diameter of the first hole, a bottom of the third hole is above the internal conductive layer, and a portion of the plating is removed between the first hole and the second hole;
• filling the first, second, and third holes with a first non-conductive filler material;
• drilling a fourth hole through the first non-conductive filler material;
• plating the fourth hole with a conductive material to form an inner layer;
• filling the fourth hole with a second non-conductive filler material;
• and
• forming a via-in-via pad on top of the second non-conductive filler connected to the inner layer.