Flexible circuit board and method of fabricating the same
AssigneesHongQiSheng Precision Electronics (QinHuangDao) Co., Ltd., Avary Holding (Shenzhen) Co., Limited., Garuda Technology Co., Ltd.
InventorsXiao-Juan ZHANG, Mei YANG, Gang YUAN
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Abstract
A flexible circuit board and a method of fabricating the same are provided. The flexible circuit board includes a first dielectric layer, a second dielectric layer disposed on the first dielectric layer, a signal layer disposed within the second dielectric layer, a third dielectric layer disposed on the second dielectric layer, and liquid metal composites. The signal layer includes a trace and a pad. The liquid metal composites are disposed to surround the trace, but not enclose the pad, thereby satisfying requirements of the signal layer for great bending numbers and high frequency signal transmission.
Claims20
A flexible circuit board, comprising:
- a first dielectric layer;
- a second dielectric layer, disposed on the first dielectric layer;
- a signal layer, disposed within the second dielectric layer, wherein the signal layer comprises a trace and a pad;
- a third dielectric layer, disposed on the second dielectric layer;
- and
- a plurality of liquid metal composites, disposed to surround the trace but not enclose the pad.
A method of fabricating a flexible circuit board, comprising:
- providing a substrate, wherein the substrate comprises a dielectric layer;
- forming a first recess within the substrate;
- forming a signal layer in the first recess;
- forming a lower dielectric layer and a first adhesive layer below the dielectric layer and the signal layer;
- forming an upper dielectric layer and a second adhesive layer over the dielectric layer and the signal layer;
- forming a second recess and a third recess within the lower dielectric layer and the upper dielectric layer, respectively, wherein the first adhesive layer is not exposed by the second recess, and the second adhesive layer is not exposed by the third recess;
- filling a plurality of liquid metal composite layers in the second recess and the third recess;
- forming a fourth recess and a fifth recess at two sides of the signal layer, and the signal layer is not exposed, wherein the fourth recess and the fifth recess extend from the upper dielectric layer through the dielectric layer into the lower dielectric layer;
- and
- filling a plurality of liquid metal composite side portions into the fourth recess and the fifth recess.
A flexible circuit board, comprising:
- a first dielectric layer;
- a first adhesive layer, disposed on the first dielectric layer;
- a second dielectric layer, disposed on the first adhesive layer;
- a second adhesive layer, disposed on the second dielectric layer;
- a third dielectric layer, disposed on the second adhesive layer;
- a signal layer, disposed within the second dielectric layer;
- two liquid metal composite side portions, disposed beside the signal layer, wherein the liquid metal composite side portions extend from the third dielectric layer through the second adhesive layer, the second dielectric layer and the first adhesive layer into the first dielectric layer;
- and
- two liquid metal composite layers, disposed within the first dielectric layer and the third dielectric layer, respectively, wherein a portion of the signal layer is surrounded by the liquid metal composite side portions and the liquid metal composite layers.
Dependencies are inferred from the claim text.