Modular chiplet system

Abstract

A modular chiplet system enables numerous unique systems to be created from a small set of chiplets and a fabric device. The modular chiplet system includes an active semiconductor substrate with a built-in network-on-chip, chiplet interfaces for connecting to stacked chiplets, power delivery networks, clocking, system management, and general-purpose I/O. A set of mechanically and electrically interchangeable rotationally symmetrical chiplets can be connected to the active semiconductor interposer, at one site of an array of N×M sites. The rotational symmetry enables I/O chiplets to be placed at any side of the active semiconductor substrate. The modular chiplet system includes a shared memory architecture that allows the chiplets to communicate with each other using memory mapped addressing and read/write transactions that are routed by the network-on-chip. The network-on-chip also enables communication between resources on or accessible via the active semiconductor substrate.

Dependencies are inferred from the claim text.