Light emitting diode module and display device having the same

A display device comprising:

• a light emitting diode (LED) module having a multi-layer structure;
• a driver integrated chip (IC) configured to drive the LED module;
• a film on glass (FOG) electrode located on the LED module and configured to be connected to the driver IC;
• and
• a controller configured to supply power to the LED module through the driver IC,
• wherein the LED module includes:
• a substrate;
• a LED on the substrate, the LED configured to emit light toward the substrate;
• a plurality of upper electrodes on the LED and connected to the LED;
• an upper insulating layer surrounding the plurality of upper electrodes;
• a film on glass (FOG) electrode on the upper insulating layer;
• and
• a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer,
• wherein the fan out interconnection structure comprises a plurality of fan out interconnection lines, each of the plurality of fan out interconnection lines is directly connected between a metal capping layer and a respective one of the plurality of upper electrodes.

A light emitting diode (LED) module comprising:

• a substrate;
• a first insulating layer on the substrate;
• a light emitting diode (LED) on the first insulating layer;
• a second insulating layer on the first insulating layer and surrounding the LED;
• a plurality of upper electrodes on the second insulating layer and connected to the LED;
• an upper insulating layer on the second insulating layer and surrounding the plurality of upper electrodes;
• a third insulating layer on the upper insulating layer;
• a film on glass (FOG) electrode on the third insulating layer;
• and
• a fan out interconnection structure configured to connect the plurality of upper electrodes to the FOG electrode through the upper insulating layer,
• wherein the fan out interconnection structure comprises a plurality of fan out interconnection lines, each of the plurality of fan out interconnection lines is directly connected between a metal capping layer and a respective one of the plurality of upper electrodes.