Semiconductor package
AssigneeSamsung Electronics Co., Ltd.
InventorsTagGun LEE, Donguk PARK, Youngseob SUH
Life of this patent
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Abstract
A semiconductor package includes first and second dies that transmit and/or receive signals with each other. The semiconductor package includes a package substrate, at least one first die on the package substrate and connected to the package substrate with an interposer therebetween, and at least one second die on the package substrate and connected to the package substrate. Each of the first and second dies includes a transmitter and a receiver, each including data lanes, and the number of the data lanes of the transmitter and/or the receiver of the first die is different from the number of the data lanes of the transmitter and/or the receiver of the second die.
Claims20
A semiconductor package comprising first and second dies that transmit and/or receive signals with each other, comprising:
- a package substrate;
- at least one the first die on the package substrate and connected to the package substrate with an interposer therebetween;
- and
- at least one the second die on the package substrate and connected to the package substrate, each of the first and second dies comprising a transmitter and a receiver, each comprising data lanes, and a number of the data lanes of the transmitter and/or the receiver of the first die is different from a number of the data lanes of the transmitter and/or the receiver of the second die.
A semiconductor package comprising:
- a package substrate;
- a first die on the package substrate and connected to the package substrate by a first interconnect;
- and
- a second die on the package substrate and connected to the package substrate by a second interconnect,
- the first interconnect comprising first bumps arranged at a first pitch, the second interconnect comprises second bumps arranged at a second pitch different from the first pitch, and
- at least one of the first and second dies comprising a remapping unit configured to allocate signals arranged in a first order to the first bumps of the first interconnect and/or the second bumps of the second interconnect in a second order different from the first order.
A method of transmitting signals from a first die to a second die, comprising:
- allowing input data lanes to be set in a first order corresponding to signals to be transmitted in a transmitter of the first die;
- allowing a first remapping unit to select output data lanes in a second order;
- outputting the signals to a receiver of the second die through the selected output data lanes;
- allowing the receiver of the second die to receive the signals output from the first die through input data lanes in a third order;
- and
- allowing a second remapping unit to select output data lanes in the first order and to output the signals.
Dependencies are inferred from the claim text.