Inter-Terminal Die-to-Die Attachment

Abstract

Integrated circuit (IC) packaging concepts that include the attachment of an auxiliary die to a primary die between the terminals of the primary die. The auxiliary die may include one or more capacitors and/or inductors as well as active circuitry (including, for example, vertical FETs). In some embodiments, more than one auxiliary IC may be attached (directly or indirectly) to a primary IC. Such a multiple IC stack configuration reduces parasitic capacitance and/or inductance compared to conventional side-by-side arrangements, and thus enables higher frequency operation. In power converters, higher operation frequency generally allows a beneficial tradeoff between reducing the capacitance requirement and/or the inductance requirement (if present) for the circuit, and generally improves the energy transfer capability of the power converter.

Dependencies are inferred from the claim text.