Systems and methods for connecting integrated circuits
AssigneeAvago Technologies International Sales Pte. Limited
InventorsTing Zhou, Jayanthi Pallinti
Life of this patent
Estimating the term…
Abstract
The subject technology is directed to integrated circuit technologies. In an embodiment, the subject technology provides a device that comprises a first circuit and a second circuit and a third circuit. The first circuit is coupled to the second circuit and the third circuit through a first interconnect. The third circuit is coupled to a fourth circuit through a second interconnect. The fourth circuit includes a processor circuit. The third circuit may support data transfer at a speed greater than what the second circuit could handle, facilitating the data transmission between the first circuit and the fourth circuit. There are other embodiments as well.
Claims20
A device comprising:
- a first circuit comprising a first side, the first side comprising a first region and a second region, the first circuit comprising a first interconnect;
- a second circuit coupled to the first region, the second circuit being coupled to the first circuit through the first interconnect;
- a third circuit coupled to the second region, the third circuit being coupled to the first circuit through the first interconnect;
- a second interconnect coupled to the third circuit;
- and
- a fourth circuit coupled to the third circuit through the second interconnect.
A device comprising:
- a first circuit comprising a first side and a second side, the first side comprising a first region and a second region, the first circuit comprising a first interconnect;
- a second circuit coupled to the first region, the second circuit being coupled to the first circuit through the first interconnect;
- a third circuit coupled to the second region, the third circuit being coupled to the first circuit through the first interconnect;
- an interposer coupled to the second side;
- and
- a fourth circuit coupled to the third circuit through the interposer.
A device comprising:
- a first circuit comprising a first side, the first side comprising a first region and a second region, the first circuit comprising a first interconnect;
- a second circuit coupled to the first region, the second circuit being coupled to the first circuit through the first interconnect;
- a third circuit coupled to the second region, the third circuit comprising a first physical layer circuit;
- a second interconnect coupled to the third circuit;
- and
- a fourth circuit comprising a second physical layer circuit, the second physical layer circuit being coupled to the first physical layer circuit through the second interconnect.
Dependencies are inferred from the claim text.