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US 2025/0029947 A1Published application
Semiconductor device with open cavity and method therefor
AssigneeNXP USA, Inc.
InventorsMichael B. Vincent, Scott M. Hayes
Life of this patent
Estimating the term…
Abstract
A method of forming a semiconductor device is provided. The method includes placing a semiconductor die and routing structure on a carrier substrate. At least a portion of the semiconductor die and routing structure are encapsulated with an encapsulant. A cavity formed in the encapsulant. A top portion of the routing structure is exposed through the cavity. A conductive trace is formed to interconnect the semiconductor die with the routing structure.
Claims21
1-9. (canceled)
A semiconductor device comprising:
- a routing structure comprising:
- a non-conductive substrate;
- and
- a plurality of conductive feeds;
- a semiconductor die having a bond pad interconnected to a conductive feed of the plurality of conductive feeds by way of a conductive trace;
- an encapsulant encapsulating at least a portion of the routing structure and the semiconductor die;
- and
- a cavity formed in the encapsulant, a top portion of the routing structure exposed through the cavity.
5 more elements
A semiconductor device comprising:
- a routing structure configured for attachment of an external component;
- a semiconductor die having a bond pad interconnected to the routing structure by way of a conductive trace;
- an encapsulant encapsulating at least a portion of the routing structure and the semiconductor die;
- and
- a cavity formed in the encapsulant, a top portion of the routing structure exposed through the cavity.
2 more elements
A semiconductor device comprising:
- a routing structure comprising:
- a non-conductive substrate;
- and
- a plurality of conductive feeds;
- a semiconductor die having a bond pad interconnected to a conductive feed of the plurality of conductive feeds by way of a conductive trace;
- an encapsulant encapsulating at least a portion of the routing structure and the semiconductor die;
- and
- a cavity formed in the encapsulant, a top portion of the routing structure exposed through the cavity, the exposed top portion of the routing structure configured for attachment of an external component.
5 more elements
Dependencies are inferred from the claim text.