Package structure
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHung-Jui Kuo, Hui-Jung Tsai, Tai-Min Chang, Chia-Wei Wang
Life of this patent
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Abstract
A package structure includes an integrated circuit die and an encapsulant laterally encapsulating the integrated circuit die. The integrated circuit die includes a semiconductor substrate, an interconnection structure, a testing pad, a dummy post, a conductive post, and a protection layer. The interconnection structure is disposed on the semiconductor substrate. The testing pad is disposed on the interconnection structure. The dummy post is disposed on the testing pad. The conductive post is aside the dummy post. The protection layer is disposed between the conductive post and the dummy post.
Claims20
A package structure, comprising:
- an integrated circuit die, comprising:
- a semiconductor substrate;
- an interconnection structure disposed on the semiconductor substrate;
- a testing pad disposed on the interconnection structure;
- a dummy post disposed on the testing pad;
- a conductive post aside the dummy post;
- and
- a protection layer disposed between the conductive post and the dummy post;
- and
- an encapsulant laterally encapsulating the integrated circuit die.
A package structure, comprising:
- an integrated circuit die, comprising:
- a semiconductor substrate;
- a testing pad disposed over the semiconductor substrate;
- a dummy post disposed on the testing pad;
- a conductive post aside the dummy post;
- and
- a protection layer disposed laterally encapsulating the conductive post and the dummy post;
- and
- an encapsulant laterally encapsulating the integrated circuit die, wherein the protection layer is formed between the encapsulant and the conductive post.
A package structure, comprising:
- an integrated circuit die, comprising:
- a semiconductor substrate;
- an interconnection structure disposed on the semiconductor substrate;
- a testing pad disposed on the interconnection structure;
- a dummy post disposed on the testing pad;
- and
- a conductive post aside the dummy post;
- an encapsulant laterally encapsulating the integrated circuit die;
- a redistribution structure disposed on the integrated circuit die and the encapsulant;
- and
- a conductive terminal disposed between the redistribution structure and the conductive post.
Dependencies are inferred from the claim text.