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US 2025/0029944 A1Published application
Memory device and method of manufacturing memory device
AssigneeSK hynix Inc.
InventorNam Jae LEE
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Abstract
A memory chip includes a plurality of micro pattern lines, a capping layer covering portions of the micro pattern lines. A bonding pad penetrates the capping layer and is coupled to one of the micro pattern lines. The bonding pad includes a first pad portion coupled to the associated micro pattern line and a second pad portion coupled to the first pad portion and exposed to a top surface of the memory chip. An upper surface of the second pad portion has a convex shape.
Claims21
A memory chip comprising:
- a plurality of micro pattern lines;
- a capping layer covering portions of the micro pattern lines;
- and
- a bonding pad penetrating the capping layer, said bonding pad being electrically coupled to a predetermined micro pattern line;
- wherein the bonding pad comprises:
- a first pad portion electrically coupled to the predetermined micro pattern line;
- and
- a second pad portion coupled to the first pad portion and exposed at a top surface of the memory chip;
- and
- wherein an upper surface of the second pad portion has a convex shape.
7 more elements
A memory device comprising:
- a memory cell array;
- a plurality of bit lines located on the memory cell array;
- first bonding pads coupled to the plurality of bit lines, respectively;
- a metal line;
- and
- second bonding pads coupled to the metal line,
- wherein the first bonding pads and the second bonding pads are bonded, and
- wherein each of the first bonding pads has a pin structure.
5 more elements
A method of manufacturing a memory device, the method comprising:
- forming a memory cell array and a plurality of conductive patterns on a substrate;
- forming a capping layer on upper portions of the plurality of conductive patterns, and then forming a plurality of holes through which the plurality of conductive patterns are exposed;
- forming a barrier metal layer and a metal seed layer along an upper surface of the capping layer and sidewalls and bottom surfaces of the plurality of holes;
- forming a pad mask pattern including openings through which pad areas overlapping the holes are exposed on the metal seed layer;
- and
- forming bonding pad patterns filling the openings.
3 more elements
Dependencies are inferred from the claim text.