Semiconductor device package and the method of manufacturing the same
AssigneeAdvanced Semiconductor Engineering, Inc.
InventorsYa Fang CHAN, Yuan-Feng CHIANG, Po-Wei LU
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Abstract
The present disclosure provides a semiconductor device package. The semiconductor device package includes a dielectric layer. The semiconductor device package further includes an antenna structure disposed in the dielectric layer. The semiconductor device package further includes a semiconductor device disposed on the dielectric layer. The semiconductor device package further includes an encapsulant covering the semiconductor device. The semiconductor device package further includes a conductive pillar having a first portion and a second portion. The first portion surrounded by the encapsulant and the second portion embedded in the dielectric layer.
Claims20
A semiconductor device package, comprising:
- a dielectric layer;
- a semiconductor device having a first surface, a second surface opposite to the first surface, and a plurality of side extending between the first surface and the second surface, wherein the second surface in contact with the dielectric layer;
- an encapsulant surrounding and continuously, directly contacting the plurality of sides and the first surface of the semiconductor device;
- and
- an antenna structure overlapping the semiconductor device in a first direction perpendicular to the first surface.
A semiconductor device package, comprising:
- a semiconductor device;
- an antenna structure electrically connected to the semiconductor device and having a curved surface;
- and
- an encapsulant encapsulating the semiconductor device.
A semiconductor device package, comprising:
- a plurality of antenna elements, wherein a first antenna element of the antenna elements has a lower surface and a lateral surface non-perpendicular to the lower surface;
- and
- a semiconductor device disposed above and electrically connected to the first antenna element of the antenna elements.
Dependencies are inferred from the claim text.