Semiconductor device and semiconductor module

A semiconductor device, comprising:

• a wiring terminal that includes an insulating layer, a first conductive layer formed on one main surface of the insulating layer, and a second conductive layer formed on another main surface of the insulating layer, the insulating layer having an insulating peripheral side that extends more outwardly than a conductive peripheral side of each of the first conductive layer and the second conductive layer;
• and
• a semiconductor module, wherein the semiconductor module includes
• a semiconductor chip having a first electrode and a second electrode,
• a first terminal electrically connected to the first electrode, the first terminal including a first end part having a first contact surface in contact with the first conductive layer of the wiring terminal
• a second terminal electrically connected to the second electrode, the second terminal including a second end part having a second contact surface, the second contact surface being away from the first end part, being parallel to the first contact surface and being in contact with the second conductive layer of the wiring terminal, and
• a fixed part, having a basal surface which faces the insulating peripheral side of the wiring terminal and from which the first end part and the second end part extend to an outside of the fixed part in a same direction, the fixing part fixing inside thereof positions of the first terminal and the second terminal with respect to a position of the semiconductor chip, and having a recess in the basal surface between the first end part and the second end part, the insulating peripheral side of the insulating layer of the wiring terminal being inserted into the recess.