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US 2025/0029931 A1Published application
Package assembly for integrated circuit
AssigneeCisco Technology, Inc.
InventorsMike Sapozhnikov, Amendra Koul, David Nozadze, Joel Richard Goergen, Sayed Ashraf Mamun, Srinath Penugonda
Life of this patent
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Abstract
In some embodiments, an integrated circuit (IC) includes multiple packages that are separate from one another. Each package includes a pad, and a core via is electrically coupled to the pads of the separate packages to electrically couple the packages to one another. At least one of the pads includes an oblong shape to match its impedance with the impedance of the core via.
Claims20
An apparatus comprising:
- a plurality of packages of an integrated circuit (IC);
- a core via extending between a first package of the plurality of packages and a second package of the plurality of packages;
- and
- a pad electrically coupling the core via to the first package, wherein the pad comprises an oblong shape.
1 more element
A method comprising:
- positioning a core via between a first package of an integrated circuit (IC) and a second package of the IC;
- and
- electrically coupling the core via to an oblong pad of the first package to electrically couple the core via to the first package.
An apparatus comprising:
- a first pad of a first package of an integrated circuit (IC);
- a second pad of a second package of the IC;
- and
- a core via having a first end connected to the first pad and a second end connected to the second pad to electrically couple to the first package and to the second package,
- wherein at least one of the first pad and the second pad is oblong.
2 more elements
Dependencies are inferred from the claim text.