Semiconductor device and vehicle

A semiconductor device, comprising:

• a wiring board;
• a semiconductor element disposed on the wiring board, the semiconductor element including a main electrode, which includes a first pad and a second pad, provided on an upper surface thereof and an insulating layer extending a first direction between the first pad and the second pad on the upper surface thereof to separate the first pad and the second pad from each other;
• and
• a lead having a bonding surface that is bonded to the main electrode of the semiconductor element by a bonding material and having an upper surface opposite to the bonding surface, wherein
• the lead at its bonding surface has a recess that faces the main electrode of the semiconductor element so as to overlap the insulating layer in a plan view of the semiconductor device, is recessed toward the upper surface of the lead, and extends in the first direction, the recess having two outer ends opposite to each other in the first direction, one of the two outer ends of the recess overlapping one end of the lead in the plan view, the recess having a bottom surface that faces the main electrode of the semiconductor element, is not in contact with the bonding material, and is continuous from the one of the two outer ends thereof to another end thereof in the first direction.