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US 2025/0029921 A1Published application
Selectable Monolithic or External Scalable Die-to-Die Interconnection System Methodology
AssigneeApple Inc.
InventorsSanjay Dabral, Jun Zhai, Jung-Cheng Yeh, Kunzhong Hu, Raymundo Camenforte, Thomas Hoffmann
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Abstract
Multi-die structures and methods of fabrication are described. In an embodiment, a multi-die structure includes a first die, a second die, and die-to-die routing connecting the first die to the second die. The die-to-die interconnection may be monolithically integrated as a chip-level die-to-die routing, or external package-level die-to-die routing.
Claims15
A multi-die structure including:
- a routing layer including:
- a first side including a package-level bonding layer, a first package-level bond pad, a second package-level bond pad;
- a second side opposite the first side;
- and
- a package-level die-to-die routing electrically connecting the first package-level bond pad to the second package-level bond pad;
- a first die hybrid bonded to the package-level bonding layer and the first package-level bond pad;
- and
- a second die hybrid bonded to the with the package-level bonding layer and the second package-level bond pad;
- wherein the first die includes:
- a first front-end-of-the-line (FEOL) die area including a communication device selected from the group consisting of a transceiver and a receiver;
- and
- a first back-end-of-the-line (BEOL) build-up structure spanning over the first FEOL die area, the first BEOL build-up structure including a first bond pad bonded directly to the first package-level bond pad.
9 more elements
Dependencies are inferred from the claim text.