US 2025/0029910 A1Published application

Electronic component

AssigneeInnolux Corporation

InventorsYeong-E Chen, Yi-Hung Lin, Cheng-En Cheng, Wen-Hsiang Liao, Cheng-Chi Wang

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Abstract

An electronic component includes a first electronic unit including a plurality of pads, a first conductive layer, a second conductive layer, a first insulating layer having a first thickness, a second insulating layer having a second thickness, a second electronic unit, and a solder ball. The first conductive layer is disposed between the first electronic unit and the second conductive layer, and electrically connected to at least one of the pads through a conductive via. The first insulating layer is disposed between the first conductive layer and the second conductive layer. The second conductive layer is disposed between the first insulating layer and the second insulating layer. The first thickness is different from the second thickness. The second conductive layer is disposed between the first conductive layer and the second electronic unit. The second conductive layer is electrically connected to the second electronic unit through the solder ball.

Claims10

Dependent claims

An electronic component, comprising:

a first electronic unit, comprising a plurality of pads;
a first conductive layer and a second conductive layer, wherein the first conductive layer is disposed between the first electronic unit and the second conductive layer, and the first conductive layer is electrically connected to at least one of the plurality of pads through a conductive via;
a first insulating layer disposed between the first conductive layer and the second conductive layer, wherein the first insulating layer has a first thickness;
a second insulating layer, wherein the second conductive layer is disposed between the first insulating layer and the second insulating layer, and the second insulating layer has a second thickness, and the first thickness is different from the second thickness;
a second electronic unit, wherein the second conductive layer is disposed between the first conductive layer and the second electronic unit;
and
a solder ball, wherein the second conductive layer is electrically connected to the second electronic unit through the solder ball.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 18/909,897Filed 8 Oct 2024
Priority: CN 202111095423.217 Sep 2021
Published: 23 Jan 2025
Term ends: Not estimatedThe source records don’t support an estimate.

Classification9 codes

H10W 90/401
Package configurations: characterised by multiple insulating or insulated package substrates, interposers or RDLs
H10W 70/05
Manufacture or treatment: of insulating or insulated package substrates, or of interposers, or of redistribution layers
H10W 70/65
Characterised by their interconnections: shapes or dispositions of interconnections
H10W 70/685
Shapes or dispositions thereof: comprising multiple insulating layers

Family

Application17/523,895Continuation · filed 10 Nov 2021
Application18/909,897Continuation
US 12,142,554 B2Related patent
US 2023/0090376 A1Published application
US 2025/0029910 A1This patent

From the US filing history. Foreign family members aren’t listed.