Package device
AssigneeInnolux Corporation
InventorsYeong-E CHEN, Cheng-En CHENG, Yu-Ting LIU
Life of this patent
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Abstract
A package device is provided and includes a redistribution layer. The redistribution layer includes a first dielectric layer, a conductive layer and a second dielectric layer, and the conductive layer is disposed between the first dielectric layer and the second dielectric layer. The redistribution layer has a test pattern including a conductive pattern, and the conductive pattern is formed of the conductive layer. The conductive pattern comprises a plurality of sub-portions arranged along at least one direction, and sizes of the plurality of sub-portions increase sequentially along the at least one direction.
Claims10
A package device, comprising:
- a redistribution layer comprising a first dielectric layer, a conductive layer and a second dielectric layer, and the conductive layer disposed between the first dielectric layer and the second dielectric layer, wherein the redistribution layer has a test pattern, the test pattern comprises a conductive pattern, and the conductive pattern is formed of the conductive layer,
- wherein the conductive pattern comprises a plurality of sub-portions arranged along at least one direction, and sizes of the plurality of sub-portions increase sequentially along the at least one direction.
Dependencies are inferred from the claim text.