Structure of chip package integrated antenna and manufacturing method thereof

A manufacturing method of a chip package integrated antenna, comprising:

• a unit disposing step comprising disposing at least one chip unit and at least two conductive units on a substrate;
• an encapsulation forming step comprising forming an encapsulation on the substrate to cover the at least one chip unit and the at least two conductive units, wherein the encapsulant has a top surface, and the top surface comprises at least two marked areas positioned to the at least two conductive units;
• a hole forming step comprising performing a hole-opening process on the at least two marked areas to respectively form at least two through holes in the encapsulation, and exposing the at least two conductive units;
• a conductive structure disposing step comprising disposing at least two conductive structures on the at least two conductive units, wherein the at least two conductive structures are respectively located in the at least two through holes;
• and
• an antenna pad printing step comprising performing a pad printing process to form an antenna on the top surface, and connecting the antenna to the at least two conductive structures, so that the antenna is electrically connected to the at least one chip unit through the at least two conductive structures, the at least two conductive units and the substrate in sequence.