Semiconductor frame and semiconductor package including the same

Abstract

A semiconductor package is provided. The semiconductor package includes a first semiconductor frame that includes a first lead frame and a first insulating layer disposed below the first lead frame; a second semiconductor frame that includes a second lead frame that faces the first lead frame and a second insulating layer disposed on the second lead frame; a semiconductor element that is disposed between the first semiconductor frame and the second semiconductor frame; and a molding portion that surrounds and seals at least a portion of the first semiconductor frame, at least a portion of the second semiconductor frame, and the semiconductor element.

Dependencies are inferred from the claim text.