Semiconductor package film and manufacturing method thereof
AssigneeSamsung Display Co., Ltd.
InventorsJi Ye LEE, Ho Suk MAENG, Soo Yeon KIM
Life of this patent
Estimating the term…
Abstract
A semiconductor package film includes a base film having sprocket holes arranged in a first direction in an edge area at a periphery of a main area. The edge area is adjacent to the main area in a second direction intersecting the first direction. The semiconductor package film includes a circuit line disposed in the main area, and a support member disposed on the base film, the support member being adjacent to the sprocket holes in the edge area. The support member includes a support extending in the first direction, and protective walls connected to the support. The protective walls are spaced apart from each other with the sprocket holes disposed between the protective walls.
Claims20
A semiconductor package film comprising:
- a base film having sprocket holes arranged in a first direction in an edge area at a periphery of a main area, the edge area being adjacent to the main area in a second direction intersecting the first direction;
- a circuit line disposed in the main area;
- and
- a support member disposed on the base film, the support member being adjacent to the sprocket holes in the edge area, wherein
- the support member includes:
- a support extending in the first direction;
- and
- protective walls connected to the support, and
- the protective walls are spaced apart from each other with the sprocket holes disposed between the protective walls.
A semiconductor package film having first and second edge areas and a main area which is disposed between the first and second edge areas, the semiconductor package film comprising:
- a base film having first sprocket holes arranged in a first direction in the first edge area and second sprocket holes arranged in the first direction in the second edge area, the first and second edge areas being spaced apart from each other in a second direction intersecting the first direction;
- a first support member disposed on the base film, the first support member being adjacent to the first sprocket holes in the first edge area;
- and
- a second support member disposed on the base film, the second support member being adjacent to the second sprocket holes in the second edge area, wherein
- the first support member includes a first support extending in the first direction and first protective walls connected to the first support, the first protective walls being spaced apart from each other with the first sprocket holes disposed between the first protective walls, and
- the second support member includes a second support extending in the first direction and second protective walls connected to the second support, the second protective walls being spaced apart from each other with the second sprocket holes disposed between the second protective walls.
A method of manufacturing a semiconductor package film, the method comprising:
- forming a multi-layer structure including a base film and a copper layer, the multi-layer structure including a main area and an edge area adjacent to the main area in a first direction;
- forming sprocket holes arranged in a second direction intersecting the first direction in the edge area;
- forming a photoresist pattern on the copper layer;
- and
- forming a support member by removing at least part of the copper layer using the photoresist pattern, wherein
- the support member includes:
- a support extending in the second direction;
- and
- protective walls connected to the support, and
- the protective walls are spaced apart from each other with the sprocket holes disposed between the protective walls.
Dependencies are inferred from the claim text.