Lead frame and manufacturing method of semiconductor device

A manufacturing method of semiconductor device, comprising:

• (a) providing a lead frame, wherein the lead frame comprises a central region and a peripheral region surrounding the central region, the lead frame comprises a plurality of leads, and the leads are at the peripheral region;
• (b) providing a die, wherein the die comprises an active surface;
• (c) forming a plurality of bumps on the active surface of the die;
• (d) forming a solder pad on an upper surface of one of two ends of each of the leads, wherein for each of the leads, the end having the solder pad is nearer to the central region of the lead frame with respect to the other end;
• (e) contacting the bumps to the corresponding solder pads;
• and
• (f) performing a reflow procedure so that each of the solder pads is directly soldered to a corresponding one of the bumps.

A manufacturing method of semiconductor device, comprising:

• (a) providing a lead frame, wherein the lead frame comprises a central region and a peripheral region surrounding the central region, the lead frame comprises a die-bonding region and a plurality of leads, the die-bonding region is at the central region, the die-bonding region comprises a metal layer, and the leads are at the peripheral region;
• (b) disposing an insulation layer on the metal layer, wherein one of two ends of each of the leads is disposed on the insulation layer;
• (c) providing a die, wherein the die comprises an active surface;
• (d) forming a plurality of bumps on the active surface of the die;
• (e) forming a solder pad on an upper surface of the end of each of the leads disposed on the insulation layer;
• (f) contacting the bumps to the corresponding solder pads;
• and
• (g) performing a reflow procedure ing so that each of the solder pads is directly soldered to a corresponding one of the bumps.